{"title":"硅衬底噪声耦合分析模型参数的自动提取","authors":"B. Peterson, K. Mayaram, T. Fiez","doi":"10.1109/CICC.2007.4405862","DOIUrl":null,"url":null,"abstract":"An automated process, requiring the fabrication of only a few simple test structures, can efficiently characterize a silicon substrate by extracting the process constants of a Z-parameter based macromodel. The resulting model is used to generate a resistive substrate network that can be used in noise coupling simulations. This process has been integrated into the Cadence DFII environment to provide a seamless substrate noise simulation package which alleviates the need for pre-characterized libraries.","PeriodicalId":130106,"journal":{"name":"2007 IEEE Custom Integrated Circuits Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Automated Extraction of Model Parameters for Noise Coupling Analysis in Silicon Substrates\",\"authors\":\"B. Peterson, K. Mayaram, T. Fiez\",\"doi\":\"10.1109/CICC.2007.4405862\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An automated process, requiring the fabrication of only a few simple test structures, can efficiently characterize a silicon substrate by extracting the process constants of a Z-parameter based macromodel. The resulting model is used to generate a resistive substrate network that can be used in noise coupling simulations. This process has been integrated into the Cadence DFII environment to provide a seamless substrate noise simulation package which alleviates the need for pre-characterized libraries.\",\"PeriodicalId\":130106,\"journal\":{\"name\":\"2007 IEEE Custom Integrated Circuits Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.2007.4405862\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.2007.4405862","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automated Extraction of Model Parameters for Noise Coupling Analysis in Silicon Substrates
An automated process, requiring the fabrication of only a few simple test structures, can efficiently characterize a silicon substrate by extracting the process constants of a Z-parameter based macromodel. The resulting model is used to generate a resistive substrate network that can be used in noise coupling simulations. This process has been integrated into the Cadence DFII environment to provide a seamless substrate noise simulation package which alleviates the need for pre-characterized libraries.