{"title":"1.55 /spl mu/m激光模组的三维有限元模拟","authors":"Y. Deshayes, L. Bechoul, Y. Danto","doi":"10.1109/IPFA.2002.1025611","DOIUrl":null,"url":null,"abstract":"Deals with results achieved from nonlinear thermomechanical simulations using finite element method (FEM) of a direct modulation 1.55 /spl mu/m laser module for telecommunication applications. In this paper, two main parts will be developed: evaluation of stresses and strains in the critical zones based on both technological and thermomechanical analyses of the whole laser module (construction design, dissimilar materials, mismatched CTE) and relation between calculated strains and optical misalignment responsible for gradual power drift. Experimental failure analysis will be also conducted to validate thermomechanical simulations, focused in particular on laser weld joints. In this context, both thermal, electrical and thermomechanical simulations on the package must be realized using an original approach based on multiphysics computations of ANSYS software.","PeriodicalId":328714,"journal":{"name":"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Three-dimensional FEM simulations of thermomechanical stresses in 1.55 /spl mu/m laser modules\",\"authors\":\"Y. Deshayes, L. Bechoul, Y. Danto\",\"doi\":\"10.1109/IPFA.2002.1025611\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Deals with results achieved from nonlinear thermomechanical simulations using finite element method (FEM) of a direct modulation 1.55 /spl mu/m laser module for telecommunication applications. In this paper, two main parts will be developed: evaluation of stresses and strains in the critical zones based on both technological and thermomechanical analyses of the whole laser module (construction design, dissimilar materials, mismatched CTE) and relation between calculated strains and optical misalignment responsible for gradual power drift. Experimental failure analysis will be also conducted to validate thermomechanical simulations, focused in particular on laser weld joints. In this context, both thermal, electrical and thermomechanical simulations on the package must be realized using an original approach based on multiphysics computations of ANSYS software.\",\"PeriodicalId\":328714,\"journal\":{\"name\":\"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2002.1025611\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2002.1025611","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Three-dimensional FEM simulations of thermomechanical stresses in 1.55 /spl mu/m laser modules
Deals with results achieved from nonlinear thermomechanical simulations using finite element method (FEM) of a direct modulation 1.55 /spl mu/m laser module for telecommunication applications. In this paper, two main parts will be developed: evaluation of stresses and strains in the critical zones based on both technological and thermomechanical analyses of the whole laser module (construction design, dissimilar materials, mismatched CTE) and relation between calculated strains and optical misalignment responsible for gradual power drift. Experimental failure analysis will be also conducted to validate thermomechanical simulations, focused in particular on laser weld joints. In this context, both thermal, electrical and thermomechanical simulations on the package must be realized using an original approach based on multiphysics computations of ANSYS software.