{"title":"环氧基底填料的粘接性能及热机械性能","authors":"S. Luo, T. Yamashita, C. Wong","doi":"10.1109/ADHES.2000.860576","DOIUrl":null,"url":null,"abstract":"The adhesion and thermo-mechanical properties of epoxy underfills depend on the epoxy resin, the hardener, and the catalyst. In this study, three different epoxy resins, ERL4221 (cycloaliphatic type), EPON862 (bisphenol F type), and EPON 8281 (bisphenol A type), were cured with 4-methylhexahydrophthalic anhydride (MHHA) as the hardener using different catalysts: cobalt acetylacetonate (CAA), imidazole derivatives, and tertiary amines. The flow behavior of the epoxy systems was studied with a rheometer. The curing profiles were recorded using a differential scanning calorimeter (DSC), revealing varying catalytic effect for the different catalysts. The curing peak temperature increased in the following order: tertiary amine<imidazole derivatives<cobalt acetylacetonate. The bulk properties of the systems were studied through a thermo-mechanical analyzer (TMA). Epoxy resins cured with different catalysts showed different glass transition temperatures (T/sub g/) and coefficients of thermal expansion (CTE). Among them, the CAA catalyzed systems showed the highest T/sub g/ and low CTE. Due to the cycloaliphatic structure of the ERL4221 resin, the cured ERL4221 systems showed the highest T/sub g/ compared to the other systems with the same catalysts. EPON8281 systems generally had lower moisture absorption than the other epoxy systems. The surface tension of the underfills was measured. The adhesion strength was evaluated by a die shear test with SiO/sub 2/ and Si/sub 3/N/sub 4/ (SiN) passivated silicon dies as substrates.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Adhesion performance and thermo-mechanical property of epoxy-based underfill\",\"authors\":\"S. Luo, T. Yamashita, C. Wong\",\"doi\":\"10.1109/ADHES.2000.860576\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The adhesion and thermo-mechanical properties of epoxy underfills depend on the epoxy resin, the hardener, and the catalyst. In this study, three different epoxy resins, ERL4221 (cycloaliphatic type), EPON862 (bisphenol F type), and EPON 8281 (bisphenol A type), were cured with 4-methylhexahydrophthalic anhydride (MHHA) as the hardener using different catalysts: cobalt acetylacetonate (CAA), imidazole derivatives, and tertiary amines. The flow behavior of the epoxy systems was studied with a rheometer. The curing profiles were recorded using a differential scanning calorimeter (DSC), revealing varying catalytic effect for the different catalysts. The curing peak temperature increased in the following order: tertiary amine<imidazole derivatives<cobalt acetylacetonate. The bulk properties of the systems were studied through a thermo-mechanical analyzer (TMA). Epoxy resins cured with different catalysts showed different glass transition temperatures (T/sub g/) and coefficients of thermal expansion (CTE). Among them, the CAA catalyzed systems showed the highest T/sub g/ and low CTE. Due to the cycloaliphatic structure of the ERL4221 resin, the cured ERL4221 systems showed the highest T/sub g/ compared to the other systems with the same catalysts. EPON8281 systems generally had lower moisture absorption than the other epoxy systems. The surface tension of the underfills was measured. The adhesion strength was evaluated by a die shear test with SiO/sub 2/ and Si/sub 3/N/sub 4/ (SiN) passivated silicon dies as substrates.\",\"PeriodicalId\":222663,\"journal\":{\"name\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"volume\":\"75 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ADHES.2000.860576\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860576","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Adhesion performance and thermo-mechanical property of epoxy-based underfill
The adhesion and thermo-mechanical properties of epoxy underfills depend on the epoxy resin, the hardener, and the catalyst. In this study, three different epoxy resins, ERL4221 (cycloaliphatic type), EPON862 (bisphenol F type), and EPON 8281 (bisphenol A type), were cured with 4-methylhexahydrophthalic anhydride (MHHA) as the hardener using different catalysts: cobalt acetylacetonate (CAA), imidazole derivatives, and tertiary amines. The flow behavior of the epoxy systems was studied with a rheometer. The curing profiles were recorded using a differential scanning calorimeter (DSC), revealing varying catalytic effect for the different catalysts. The curing peak temperature increased in the following order: tertiary amine
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
