大型封装密集微波电路的仿真

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634068

P. Petre, G. Valley, R. T. Kihm, S. Gedney

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引用次数: 0

摘要

采用一种新的快速矩码方法对封装、密集、平面微波电路进行性能预测和电磁特性计算。结果表明，像收发(T/R)模块这样大的电路不能用商业工具精确模拟，可以用这种方法建模。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Simulation of large packaged dense microwave circuits

A new fast method of moments code is used to predict the performance and calculate the electromagnetic properties of packaged, dense, planar microwave circuits. It is demonstrated that circuits as large as transmit/receive (T/R) modules that cannot be simulated accurately with commercial tools can be modeled with this method.

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Electrical Performance of Electronic Packaging

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