300mm技术现状及未来展望

1997 Symposium on VLSI Technology Pub Date : 1997-06-10 DOI:10.1109/VLSIT.1997.623667

Komiya

{"title":"300mm技术现状及未来展望","authors":"Komiya","doi":"10.1109/VLSIT.1997.623667","DOIUrl":null,"url":null,"abstract":"Development of the 300¿ technology is approaching the exciting part of the program. The transition in the wafer diameter fiom 200¿ to 300¿ is expected to result in the chip cost reduction by the range of 1.520% and to decrease the investment in the production line down to about 65%. The technological key issues would be the crystal growth and the heat treatment. World-wide cooperative efforts are being made for the evaluation of the equipment and materials and for the standardiition.","PeriodicalId":414778,"journal":{"name":"1997 Symposium on VLSI Technology","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-06-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"The 300mm Technology Current Status And Future Prospect\",\"authors\":\"Komiya\",\"doi\":\"10.1109/VLSIT.1997.623667\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Development of the 300¿ technology is approaching the exciting part of the program. The transition in the wafer diameter fiom 200¿ to 300¿ is expected to result in the chip cost reduction by the range of 1.520% and to decrease the investment in the production line down to about 65%. The technological key issues would be the crystal growth and the heat treatment. World-wide cooperative efforts are being made for the evaluation of the equipment and materials and for the standardiition.\",\"PeriodicalId\":414778,\"journal\":{\"name\":\"1997 Symposium on VLSI Technology\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-06-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.1997.623667\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.1997.623667","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

摘要

300¿技术的开发正接近该计划令人兴奋的部分。晶圆直径从200英寸到300英寸的转变预计将使芯片成本降低1.520%，并将生产线的投资减少到65%左右。工艺的关键是晶体的生长和热处理。目前正在进行世界范围的合作努力，以评价设备和材料并进行标准化。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The 300mm Technology Current Status And Future Prospect

Development of the 300¿ technology is approaching the exciting part of the program. The transition in the wafer diameter fiom 200¿ to 300¿ is expected to result in the chip cost reduction by the range of 1.520% and to decrease the investment in the production line down to about 65%. The technological key issues would be the crystal growth and the heat treatment. World-wide cooperative efforts are being made for the evaluation of the equipment and materials and for the standardiition.

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来源期刊

1997 Symposium on VLSI Technology

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