使用3d打印空心衬底集成波导的x波段无源电路

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI:10.1109/ectc51906.2022.00150

Yihang Chu, Yamini Kotriwar, Ethan Kepros, Brian Wright, P. Chahal

{"title":"使用3d打印空心衬底集成波导的x波段无源电路","authors":"Yihang Chu, Yamini Kotriwar, Ethan Kepros, Brian Wright, P. Chahal","doi":"10.1109/ectc51906.2022.00150","DOIUrl":null,"url":null,"abstract":"This paper investigates the use of additive manufacturing (AM) for the fabrication of hollow or air substrate integrated waveguides (SIW or reduced height waveguides). The method relies on additive manufacturing (3-D fabrication) using a simple resin printer. A bandpass filter and a slot antenna working in the X-band are demonstrated. The simulation and measured results match closely and show that low-cost table top resin printers can fabricate microwave passive components with good performance.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"X-band Passive Circuits Using 3-D Printed Hollow Substrate Integrated Waveguides\",\"authors\":\"Yihang Chu, Yamini Kotriwar, Ethan Kepros, Brian Wright, P. Chahal\",\"doi\":\"10.1109/ectc51906.2022.00150\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper investigates the use of additive manufacturing (AM) for the fabrication of hollow or air substrate integrated waveguides (SIW or reduced height waveguides). The method relies on additive manufacturing (3-D fabrication) using a simple resin printer. A bandpass filter and a slot antenna working in the X-band are demonstrated. The simulation and measured results match closely and show that low-cost table top resin printers can fabricate microwave passive components with good performance.\",\"PeriodicalId\":139520,\"journal\":{\"name\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ectc51906.2022.00150\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00150","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文研究了使用增材制造(AM)来制造中空或空气基板集成波导(SIW或低高度波导)。该方法依赖于使用简单的树脂打印机的增材制造(3d制造)。演示了一种工作在x波段的带通滤波器和缝隙天线。仿真结果与实测结果吻合较好，表明桌面型树脂打印机可以制造出性能良好的微波无源元件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

X-band Passive Circuits Using 3-D Printed Hollow Substrate Integrated Waveguides

This paper investigates the use of additive manufacturing (AM) for the fabrication of hollow or air substrate integrated waveguides (SIW or reduced height waveguides). The method relies on additive manufacturing (3-D fabrication) using a simple resin printer. A bandpass filter and a slot antenna working in the X-band are demonstrated. The simulation and measured results match closely and show that low-cost table top resin printers can fabricate microwave passive components with good performance.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

自引率

0.00%

发文量