{"title":"小尺寸焊球缺陷检测方法的研究","authors":"Xiuyun Zhou, Yaqiu Chen, Xiaochuan Lu","doi":"10.1109/ICAM.2017.8242171","DOIUrl":null,"url":null,"abstract":"In order to solve defect detection problem of small-size solder ball in the high density chip, the method based on the pulsed eddy current thermal imaging technology (ECPT) was put forward to study the solder ball defects. With establishing 3D induction heating finite element model, the defects such as cracks, voids can be distinguished by comparing the different temperature field. Furthermore, the experiments with solder balls of different defects and various crack size are carried out. Both experiment result and simulation study verify the reliability and convenience of ECPT method.","PeriodicalId":117801,"journal":{"name":"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2017-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Study on detection method of small-size solder ball defects\",\"authors\":\"Xiuyun Zhou, Yaqiu Chen, Xiaochuan Lu\",\"doi\":\"10.1109/ICAM.2017.8242171\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to solve defect detection problem of small-size solder ball in the high density chip, the method based on the pulsed eddy current thermal imaging technology (ECPT) was put forward to study the solder ball defects. With establishing 3D induction heating finite element model, the defects such as cracks, voids can be distinguished by comparing the different temperature field. Furthermore, the experiments with solder balls of different defects and various crack size are carried out. Both experiment result and simulation study verify the reliability and convenience of ECPT method.\",\"PeriodicalId\":117801,\"journal\":{\"name\":\"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICAM.2017.8242171\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICAM.2017.8242171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study on detection method of small-size solder ball defects
In order to solve defect detection problem of small-size solder ball in the high density chip, the method based on the pulsed eddy current thermal imaging technology (ECPT) was put forward to study the solder ball defects. With establishing 3D induction heating finite element model, the defects such as cracks, voids can be distinguished by comparing the different temperature field. Furthermore, the experiments with solder balls of different defects and various crack size are carried out. Both experiment result and simulation study verify the reliability and convenience of ECPT method.
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