在倒装芯片中使用计算机断层扫描进行先进的非破坏性故障隔离

Z. Syahirah, R. Gopmath, M. Tay
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引用次数: 2

摘要

随着封装集成度在器件小型化方面达到饱和点,由于封装复杂性的增加和封装尺寸的缩小,使用实时x射线对倒芯片封装缺陷进行故障隔离,即使使用高倍率观察,也面临着更多的挑战。计算机断层扫描(CT) x射线是克服这一问题的一种解决方案。本文比较了利用CT x射线平台进行二维和三维x射线图像的缺陷检测。我们提出了具体的案例研究讨论的各种缺陷是具有挑战性的二维x射线,但有效地隔离了三维x射线。
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Advanced non-destructive fault isolation using computed tomography in flip-chip devices
As package integration has reached a saturation point in device miniaturization, fault isolation of flip-chip packaging defects using real-time X-ray, even when using high-magnification viewing, is facing more challenges due to the increase in package complexity and shrinking package dimensions. Computed tomography (CT) X-ray is a solution to overcome this problem. This paper compares defect detection between 2D and 3D X-ray images using the CT X-ray platform. We present specific case study discussions of various defects that were challenging for 2D X-ray but effectively isolated by 3D X-ray.
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