{"title":"在倒装芯片中使用计算机断层扫描进行先进的非破坏性故障隔离","authors":"Z. Syahirah, R. Gopmath, M. Tay","doi":"10.1109/EPTC.2012.6507140","DOIUrl":null,"url":null,"abstract":"As package integration has reached a saturation point in device miniaturization, fault isolation of flip-chip packaging defects using real-time X-ray, even when using high-magnification viewing, is facing more challenges due to the increase in package complexity and shrinking package dimensions. Computed tomography (CT) X-ray is a solution to overcome this problem. This paper compares defect detection between 2D and 3D X-ray images using the CT X-ray platform. We present specific case study discussions of various defects that were challenging for 2D X-ray but effectively isolated by 3D X-ray.","PeriodicalId":431312,"journal":{"name":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Advanced non-destructive fault isolation using computed tomography in flip-chip devices\",\"authors\":\"Z. Syahirah, R. Gopmath, M. Tay\",\"doi\":\"10.1109/EPTC.2012.6507140\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As package integration has reached a saturation point in device miniaturization, fault isolation of flip-chip packaging defects using real-time X-ray, even when using high-magnification viewing, is facing more challenges due to the increase in package complexity and shrinking package dimensions. Computed tomography (CT) X-ray is a solution to overcome this problem. This paper compares defect detection between 2D and 3D X-ray images using the CT X-ray platform. We present specific case study discussions of various defects that were challenging for 2D X-ray but effectively isolated by 3D X-ray.\",\"PeriodicalId\":431312,\"journal\":{\"name\":\"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2012.6507140\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2012.6507140","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advanced non-destructive fault isolation using computed tomography in flip-chip devices
As package integration has reached a saturation point in device miniaturization, fault isolation of flip-chip packaging defects using real-time X-ray, even when using high-magnification viewing, is facing more challenges due to the increase in package complexity and shrinking package dimensions. Computed tomography (CT) X-ray is a solution to overcome this problem. This paper compares defect detection between 2D and 3D X-ray images using the CT X-ray platform. We present specific case study discussions of various defects that were challenging for 2D X-ray but effectively isolated by 3D X-ray.