采用0.45 μm GaN技术的100w高功率放大器MMIC

Pramod K. Singh, K. Suman, Santosh K Gedela, Kishore Bantupalli, K. Y. Varma, R. Gongo
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引用次数: 1

摘要

在基于AlGaN/GaN的高电子迁移率晶体管中,由于高击穿电压、高电流密度和高载流子迁移率,使用氮化镓技术在微波频率下实现了非常高的输出功率水平。为此,开发了基于SiC HEMT的特定0.45 $\mu$m AlGaN/GaN的MMIC技术,该技术可在50 V的高直流偏置电压下工作,从而在微波频率下实现高功率。本文证明了在s波段完全匹配50欧姆的单个MMIC芯片可以实现超过100 W的高微波功率。除了高功率,该芯片还实现了大于50%的高功率附加效率。所实现的大功率放大芯片是一种两级放大器,在3.1-3.5 GHz频率范围内,输出功率大于50 dBm,功率增益优于22 dB,功率附加效率超过50%。MMIC芯片布局面积为5.8 × 3.3 mm2。该芯片晶体管的饱和输出功率密度达到7w /mm,是目前该技术所能达到的最大值。
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100 W High Power Amplifier MMIC in 0.45 μm GaN Technology
Very high output power level is achieved at microwave frequencies using Gallium Nitride technologies due to high breakdown voltage, high current density and high carrier mobility in AlGaN/GaN based High Electron Mobility Transistors. The specific 0.45 $\mu$m AlGaN/GaN on SiC HEMT based MMIC technology is developed for this purpose to operate at high DC bias voltage of 50 V to achieve high power at microwave frequencies. This paper demonstrates that a high microwave power exceeding 100 W can be achieved from a single MMIC chip fully matched to 50 Ohm at S-band frequencies. In addition to high power, high power added efficiency greater than 50% is also achieved in this chip. The implemented high-power amplifier chip is a two-stage amplifier achieving output power greater than 50 dBm with power gain better than 22 dB, and power added efficiency exceeding 50% over frequency range of 3.1-3.5 GHz. The MMIC chip layout area is as compact as 5.8 $\times$ 3.3 mm2. The saturated output power density of transistor in this chip reaches value of 7 W/mm, maximum possible in this technology.
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