从片上微带到矩形波导的低损耗毫米波转换

D. Cuenca, J. Hesselbarth, G. Alavi
{"title":"从片上微带到矩形波导的低损耗毫米波转换","authors":"D. Cuenca, J. Hesselbarth, G. Alavi","doi":"10.23919/eumc.2017.8231030","DOIUrl":null,"url":null,"abstract":"A new method for coupling from an on-chip microstrip line to a rectangular waveguide oriented perpendicular to the chip is presented. The coupling is realized by a 3-pole bandpass structure, containing an on-chip microstrip resonator, a dielectric spherical resonator and a waveguide cavity resonator. Measurements show a transition loss of 2.6 dB at 64 GHz and less than 3 dB loss over a 4.5% bandwidth. Simulations indicate that less than 0.2 dB of this loss are due to radiation leakage. The structure occupies small on-chip area und provides features for electrical test before assembly and for simple yet precise assembly.","PeriodicalId":120932,"journal":{"name":"2017 12th European Microwave Integrated Circuits Conference (EuMIC)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Low-loss mm-wave transition from on-chip microstrip to rectangular waveguide\",\"authors\":\"D. Cuenca, J. Hesselbarth, G. Alavi\",\"doi\":\"10.23919/eumc.2017.8231030\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new method for coupling from an on-chip microstrip line to a rectangular waveguide oriented perpendicular to the chip is presented. The coupling is realized by a 3-pole bandpass structure, containing an on-chip microstrip resonator, a dielectric spherical resonator and a waveguide cavity resonator. Measurements show a transition loss of 2.6 dB at 64 GHz and less than 3 dB loss over a 4.5% bandwidth. Simulations indicate that less than 0.2 dB of this loss are due to radiation leakage. The structure occupies small on-chip area und provides features for electrical test before assembly and for simple yet precise assembly.\",\"PeriodicalId\":120932,\"journal\":{\"name\":\"2017 12th European Microwave Integrated Circuits Conference (EuMIC)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 12th European Microwave Integrated Circuits Conference (EuMIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/eumc.2017.8231030\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 12th European Microwave Integrated Circuits Conference (EuMIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/eumc.2017.8231030","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

提出了一种从片上微带线到垂直于芯片的矩形波导耦合的新方法。该耦合是由一个片上微带谐振器、一个介电球谐振器和一个波导腔谐振器组成的三极带通结构实现的。测量结果表明,在64ghz时转换损耗为2.6 dB,在4.5%带宽下转换损耗小于3 dB。模拟表明,由于辐射泄漏造成的损耗小于0.2 dB。该结构占用片上面积小,具有装配前电气测试和简单而精确的装配特点。
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Low-loss mm-wave transition from on-chip microstrip to rectangular waveguide
A new method for coupling from an on-chip microstrip line to a rectangular waveguide oriented perpendicular to the chip is presented. The coupling is realized by a 3-pole bandpass structure, containing an on-chip microstrip resonator, a dielectric spherical resonator and a waveguide cavity resonator. Measurements show a transition loss of 2.6 dB at 64 GHz and less than 3 dB loss over a 4.5% bandwidth. Simulations indicate that less than 0.2 dB of this loss are due to radiation leakage. The structure occupies small on-chip area und provides features for electrical test before assembly and for simple yet precise assembly.
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