智能栅极驱动器在SiC功率mosfet老化检测中的应用

Mengqi Wang, Jiupeng Zhang, W. Ng, H. Nishio, Motomitsu Iwamoto, H. Sumida
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摘要

本文提出了一种集成的智能栅极驱动器(SGD),能够在运行中检测SiC功率MOSFET老化。SGD IC监测离散时间差分(DTD)栅极电压斜率$\Delta V_{GS}$,以识别米勒平台在导通期间开始的时间$t_{1}$。在已知的工作条件下,$t_{1}$的值可以作为一个老化指标来检测由于阈值电压移动而引起的米勒平台的变化。SGD内的合成数字中央控制单元(CCU)可以根据老化引起的$t_{1}$的变化来调整栅极驱动轮廓和栅极驱动母线电压($V_{DR}$)。我们证明,在200°C, $V_{DR,应力}=30\ \mathrm{V}$下,经过200小时的高温栅极偏置(HTGB), 1.2 kV 75A SiC MOSFET的老化引起的栅极退化导致漏极电流($I_{D}$)降低1.5%。$V_{\text{MP}}$每增加0.5 V,可使$I_{D}$恢复1.7%至老化前的水平。这是通过调整片上DC-DC升压转换器的数字脉宽调制(PWM)占空比来实现的。
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Application of a Smart Gate Driver to Detect Aging in SiC Power MOSFETs
In this paper we present an integrated smart gate driver (SGD) capable of in-operation detection of SiC power MOSFET aging. The SGD IC monitors the discrete time differentiated (DTD) gate voltage slope, $\Delta V_{GS}$, to identify the time to start of the Miller plateau, $t_{1}$, during turn-on. Under known operating conditions, the value of $t_{1}$ can be used as an aging indicator to detect changes in the Miller plateau due to threshold voltage shifts. A synthesized digital central control unit (CCU) within the SGD can adjust the gate drive profile and gate drive bus voltage ($V_{DR}$) based on the aging-induced changes in $t_{1}$. We demonstrate that following 200 hours of high-temperature gate bias (HTGB) at 200 °C, $V_{DR, stress}=30\ \mathrm{V}$, aging-induced gate degradation of a 1.2 kV 75A SiC MOSFET results in a decrease in drain current ($I_{D}$) by 1.5%. An increase in $V_{\text{MP}}$ by 0.5 V can restore $I_{D}$ by 1.7% to pre-aged levels. This is achieved by adjusting the digital pulse width modulation (PWM) duty cycle of the on-chip DC-DC boost converter.
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