{"title":"利用导电膏体点胶制备微弹簧探针","authors":"T. Itoh, K. Kataoka, T. Suga","doi":"10.1109/MEMSYS.2006.1627785","DOIUrl":null,"url":null,"abstract":"We have developed a new fabrication technique that realizes 3-dimensional microspring probes made of conductive pastes. In the technique, ultra precise dispensing of low-temperature silver pastes on a heated substrate is continuously repeated. 50-µ m-diameter microcantilevers with an approximately 200-µ m-high post have been successfully structured on a 353 K heated substrate and their mechanical and electrical properties have been investigated. The probing resistance of as-structured cantilevers with a low contact force of 1 mN could be effectively lowered to less than 1 Ω by heat cure process with the temperature of 523 K and by fritting process with the application of 5 V -150 mA.","PeriodicalId":250831,"journal":{"name":"19th IEEE International Conference on Micro Electro Mechanical Systems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Fabricaton of Microspring Probes Using Conductive Paste Dispensing\",\"authors\":\"T. Itoh, K. Kataoka, T. Suga\",\"doi\":\"10.1109/MEMSYS.2006.1627785\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed a new fabrication technique that realizes 3-dimensional microspring probes made of conductive pastes. In the technique, ultra precise dispensing of low-temperature silver pastes on a heated substrate is continuously repeated. 50-µ m-diameter microcantilevers with an approximately 200-µ m-high post have been successfully structured on a 353 K heated substrate and their mechanical and electrical properties have been investigated. The probing resistance of as-structured cantilevers with a low contact force of 1 mN could be effectively lowered to less than 1 Ω by heat cure process with the temperature of 523 K and by fritting process with the application of 5 V -150 mA.\",\"PeriodicalId\":250831,\"journal\":{\"name\":\"19th IEEE International Conference on Micro Electro Mechanical Systems\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-05-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"19th IEEE International Conference on Micro Electro Mechanical Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.2006.1627785\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"19th IEEE International Conference on Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2006.1627785","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fabricaton of Microspring Probes Using Conductive Paste Dispensing
We have developed a new fabrication technique that realizes 3-dimensional microspring probes made of conductive pastes. In the technique, ultra precise dispensing of low-temperature silver pastes on a heated substrate is continuously repeated. 50-µ m-diameter microcantilevers with an approximately 200-µ m-high post have been successfully structured on a 353 K heated substrate and their mechanical and electrical properties have been investigated. The probing resistance of as-structured cantilevers with a low contact force of 1 mN could be effectively lowered to less than 1 Ω by heat cure process with the temperature of 523 K and by fritting process with the application of 5 V -150 mA.
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