W. Ren, Z. Qian, Minfu Lu, Sheng Liu, D. Shangguan
{"title":"两种焊料合金的热机械性能","authors":"W. Ren, Z. Qian, Minfu Lu, Sheng Liu, D. Shangguan","doi":"10.1115/imece1997-1237","DOIUrl":null,"url":null,"abstract":"\n The thermal-mechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep and fatigue, are carried out on a computer controlled 6-axis mini fatigue tester. The thin strip specimen is used in this research, which is specially designed and verified to be suitable for the testing of solder alloys and comparable to the data from the literature. Based on the experimental study it is clear that the new lead free solder alloy is a potential replacement for the currently used Sn-Pb solders for electronics packaging applications.","PeriodicalId":230568,"journal":{"name":"Applications of Experimental Mechanics to Electronic Packaging","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Thermal Mechanical Properties of Two Solder Alloys\",\"authors\":\"W. Ren, Z. Qian, Minfu Lu, Sheng Liu, D. Shangguan\",\"doi\":\"10.1115/imece1997-1237\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The thermal-mechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep and fatigue, are carried out on a computer controlled 6-axis mini fatigue tester. The thin strip specimen is used in this research, which is specially designed and verified to be suitable for the testing of solder alloys and comparable to the data from the literature. Based on the experimental study it is clear that the new lead free solder alloy is a potential replacement for the currently used Sn-Pb solders for electronics packaging applications.\",\"PeriodicalId\":230568,\"journal\":{\"name\":\"Applications of Experimental Mechanics to Electronic Packaging\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applications of Experimental Mechanics to Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece1997-1237\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applications of Experimental Mechanics to Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece1997-1237","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal Mechanical Properties of Two Solder Alloys
The thermal-mechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep and fatigue, are carried out on a computer controlled 6-axis mini fatigue tester. The thin strip specimen is used in this research, which is specially designed and verified to be suitable for the testing of solder alloys and comparable to the data from the literature. Based on the experimental study it is clear that the new lead free solder alloy is a potential replacement for the currently used Sn-Pb solders for electronics packaging applications.
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