Shuaijie Zhao, Chuantong Chen, M. Ueshima, Motoharu Haga, K. Suganuma
{"title":"通过自组装层化学键合铜和环氧树脂","authors":"Shuaijie Zhao, Chuantong Chen, M. Ueshima, Motoharu Haga, K. Suganuma","doi":"10.23919/ICEP55381.2022.9795526","DOIUrl":null,"url":null,"abstract":"Conventionally, copper and epoxy are bonded by roughening the copper surface. However, a roughed copper surface causes large resistance and delay when the frequency of current increases. Instead of roughing the surface, this work tried to use a self-assembled layer of 4- aminothiophenol (4-ATP) to bond copper and epoxy chemically. The influence of treatment time of copper in 4- APT solution was investigated. The best treatment time is 1 hour. Under this condition, the shear strength between copper and epoxy reached 24 MPa.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Chemical bonding copper and epoxy through self-assembled layer\",\"authors\":\"Shuaijie Zhao, Chuantong Chen, M. Ueshima, Motoharu Haga, K. Suganuma\",\"doi\":\"10.23919/ICEP55381.2022.9795526\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Conventionally, copper and epoxy are bonded by roughening the copper surface. However, a roughed copper surface causes large resistance and delay when the frequency of current increases. Instead of roughing the surface, this work tried to use a self-assembled layer of 4- aminothiophenol (4-ATP) to bond copper and epoxy chemically. The influence of treatment time of copper in 4- APT solution was investigated. The best treatment time is 1 hour. Under this condition, the shear strength between copper and epoxy reached 24 MPa.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795526\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795526","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Chemical bonding copper and epoxy through self-assembled layer
Conventionally, copper and epoxy are bonded by roughening the copper surface. However, a roughed copper surface causes large resistance and delay when the frequency of current increases. Instead of roughing the surface, this work tried to use a self-assembled layer of 4- aminothiophenol (4-ATP) to bond copper and epoxy chemically. The influence of treatment time of copper in 4- APT solution was investigated. The best treatment time is 1 hour. Under this condition, the shear strength between copper and epoxy reached 24 MPa.
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