{"title":"碳纳米管填充导电板固化过程中电导率的研究","authors":"Subaru Tsujimura, M. Inoue","doi":"10.23919/ICEP55381.2022.9795492","DOIUrl":null,"url":null,"abstract":"This work discusses interfacial electrical conductivity development between fillers in carbon nanotube (CNT)-filled electrically conductive pastes during curing. Interfacial electrical properties in these pastes were successfully analyzed using impedance spectroscopy. Because the equivalent circuit analysis showed a change in interfacial capacitance during curing, binder chemistry was clarified to be one of the factors in accelerating the kinetics of the interfacial conductivity development.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electrical Conductivity Development of Carbon Nanotube Filled Electrically Conductive Pates During Curing\",\"authors\":\"Subaru Tsujimura, M. Inoue\",\"doi\":\"10.23919/ICEP55381.2022.9795492\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work discusses interfacial electrical conductivity development between fillers in carbon nanotube (CNT)-filled electrically conductive pastes during curing. Interfacial electrical properties in these pastes were successfully analyzed using impedance spectroscopy. Because the equivalent circuit analysis showed a change in interfacial capacitance during curing, binder chemistry was clarified to be one of the factors in accelerating the kinetics of the interfacial conductivity development.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795492\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795492","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrical Conductivity Development of Carbon Nanotube Filled Electrically Conductive Pates During Curing
This work discusses interfacial electrical conductivity development between fillers in carbon nanotube (CNT)-filled electrically conductive pastes during curing. Interfacial electrical properties in these pastes were successfully analyzed using impedance spectroscopy. Because the equivalent circuit analysis showed a change in interfacial capacitance during curing, binder chemistry was clarified to be one of the factors in accelerating the kinetics of the interfacial conductivity development.
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