用光束感应电流技术分析模拟器件的功能失效

K. Tan, S.H. Tan, S. H. Ong
{"title":"用光束感应电流技术分析模拟器件的功能失效","authors":"K. Tan, S.H. Tan, S. H. Ong","doi":"10.1109/IPFA.1997.638367","DOIUrl":null,"url":null,"abstract":"Photoinduced current can be measured and used to modulate the gray-level of the OBIC images. Thus, the OBIC image can be used to localize the damaged transistor in LSI and VLSI devices. This is because when the pn junctions are destroyed, the leakage path no longer exhibits any blocking behavior, and thus no OBIC effect will be present. This paper presents two cases of failure analysis performed on analog devices using OBIC technique. The analysis steps and methodology used to determine the failure mechanism are described.","PeriodicalId":159177,"journal":{"name":"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Functional failure analysis on analog device by optical beam induced current technique\",\"authors\":\"K. Tan, S.H. Tan, S. H. Ong\",\"doi\":\"10.1109/IPFA.1997.638367\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Photoinduced current can be measured and used to modulate the gray-level of the OBIC images. Thus, the OBIC image can be used to localize the damaged transistor in LSI and VLSI devices. This is because when the pn junctions are destroyed, the leakage path no longer exhibits any blocking behavior, and thus no OBIC effect will be present. This paper presents two cases of failure analysis performed on analog devices using OBIC technique. The analysis steps and methodology used to determine the failure mechanism are described.\",\"PeriodicalId\":159177,\"journal\":{\"name\":\"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-07-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.1997.638367\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.1997.638367","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

光感应电流可以测量并用于调制OBIC图像的灰度级。因此,OBIC图像可以用来定位损坏的晶体管在大规模集成电路和超大规模集成电路器件。这是因为当pn结被破坏时,泄漏路径不再表现出任何阻塞行为,因此不存在OBIC效应。本文介绍了用OBIC技术对模拟器件进行失效分析的两个案例。描述了用于确定失效机制的分析步骤和方法。
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Functional failure analysis on analog device by optical beam induced current technique
Photoinduced current can be measured and used to modulate the gray-level of the OBIC images. Thus, the OBIC image can be used to localize the damaged transistor in LSI and VLSI devices. This is because when the pn junctions are destroyed, the leakage path no longer exhibits any blocking behavior, and thus no OBIC effect will be present. This paper presents two cases of failure analysis performed on analog devices using OBIC technique. The analysis steps and methodology used to determine the failure mechanism are described.
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