速率相关材料性能和几何特性对TQFP封装热力学行为的影响

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Pub Date : 2012-12-01 DOI:10.1109/EPTC.2012.6507065

Emad A. Poshtan, S. Rzepka, B. Wunderle, C. Silber, T. von Bargen, B. Michel

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引用次数: 4

摘要

本文通过仿真和实验研究了薄四平面封装(TQFP)元件的不同特性对封装性能的影响。变化的参数是包装尺寸，速率相关的材料性能，如粘弹性和固化收缩率和外部边界条件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The effects of rate-dependent material properties and geometrical characteristics on thermo-mechanical behavior of TQFP package

In this paper we examine the influence of different characteristics of TQFP (thin quad flat package) components on package behavior by simulation and experiment. The varied parameters are the package dimensions, rate-dependent material properties such as viscoelasticity and cure shrinkage and external boundary conditions.

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2012 IEEE 14th Electronics Packaging Technology Conference (EPTC)

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