{"title":"全集成稳压器微处理器中疫苗馈通噪声建模的大信号方法","authors":"S. Govindan, K. Bharath, S. Venkataraman, D. Gope","doi":"10.1109/EDAPS50281.2020.9312913","DOIUrl":null,"url":null,"abstract":"A simple and accurate method is proposed to model the Vccin feedthrough noise in microprocessors with Fully Integrated Voltage Regulators (FIVR). The method is based on averaged state-space models of FIVR and the Vccin network derived from the pole-residue models.","PeriodicalId":137699,"journal":{"name":"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Large-Signal Method for Modeling Vccin feedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators\",\"authors\":\"S. Govindan, K. Bharath, S. Venkataraman, D. Gope\",\"doi\":\"10.1109/EDAPS50281.2020.9312913\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A simple and accurate method is proposed to model the Vccin feedthrough noise in microprocessors with Fully Integrated Voltage Regulators (FIVR). The method is based on averaged state-space models of FIVR and the Vccin network derived from the pole-residue models.\",\"PeriodicalId\":137699,\"journal\":{\"name\":\"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS50281.2020.9312913\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS50281.2020.9312913","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Large-Signal Method for Modeling Vccin feedthrough Noise in Microprocessors with Fully Integrated Voltage Regulators
A simple and accurate method is proposed to model the Vccin feedthrough noise in microprocessors with Fully Integrated Voltage Regulators (FIVR). The method is based on averaged state-space models of FIVR and the Vccin network derived from the pole-residue models.
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