{"title":"封装IBM AS/400的电气挑战","authors":"G.K. Bartley, P.E. Dahlen","doi":"10.1109/EPEP.1997.634023","DOIUrl":null,"url":null,"abstract":"The list of system design concerns is growing to encompass additional electrical limitations as the frequency of operation increases. These limitations are being mitigated by increasing bus widths, added material costs, more complex technology, and some changes in physical architecture.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The electrical challenges of packaging the IBM AS/400\",\"authors\":\"G.K. Bartley, P.E. Dahlen\",\"doi\":\"10.1109/EPEP.1997.634023\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The list of system design concerns is growing to encompass additional electrical limitations as the frequency of operation increases. These limitations are being mitigated by increasing bus widths, added material costs, more complex technology, and some changes in physical architecture.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634023\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634023","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The electrical challenges of packaging the IBM AS/400
The list of system design concerns is growing to encompass additional electrical limitations as the frequency of operation increases. These limitations are being mitigated by increasing bus widths, added material costs, more complex technology, and some changes in physical architecture.
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