在2英寸直径的InP衬底上生长高纯度和高均匀性的InGaAs/InP外延层

Y. Miura, K. Takemoto, T. Iwasaki, N. Yamabayashi, M. Kaji, S. Murai, K. Tada, S. Akai
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引用次数: 1

摘要

采用氯气相外延法(VPE)在直径为2英寸的InP衬底上生长出了InP/InGaAs/InP外延结构。InP和InGaAs层的未掺杂载流子浓度均小于1*10/sup 15/ cm/sup -3/ sup。77 K时霍尔迁移率为85000 cm/sup 2//V-s。外延层厚度、载流子浓度和晶格错配的变化分别小于2%、4%和0.8%。每次运行的生长率、载流子浓度和晶格错配的重现性小于5%
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VPE growth of high purity and high uniformity InGaAs/InP epitaxial layers on 2-inch diameter InP substrate
An epitaxial InP/InGaAs/InP structure was grown on 2-in-diameter InP substrates by the chloride vapor-phase epitaxy (VPE) method. The undoped carrier concentration of both the InP and InGaAs layers was less than 1*10/sup 15/ cm/sup -3/. Hall mobility at 77 K was 85000 cm/sup 2//V-s. The variation of epi-layer thickness, carrier concentration and lattice mismatch across the wafer was less than 2%, 4% and 0.8%, respectively. The reproducibility of growth rate, carrier concentration, and lattice mismatch from run to run was less than 5%.<>
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