{"title":"球栅阵列(BGA)用Cr-CrCu-Cu薄膜的显微组织和成分失效分析","authors":"N. Zhang, M. Mcnicholas, N. Colvin","doi":"10.1109/IPFA.1997.638119","DOIUrl":null,"url":null,"abstract":"A PVD Cr-CrCu-Cu metal scheme for flip chip applications was investigated varying the conditions of deposition power and temperature, and film thickness. The thin film stress and resistivity of the Cr-CrCu-Cu multilayers and the effect of film and thermal cycle reliability were studied. Thermal cycle reliability results proved to be a function of both the CrCu alloy and the Cu overlayer thickness. Analytical Electron Microscopy (AEM) results support the diffusion barrier relationship of CrCu layer.","PeriodicalId":159177,"journal":{"name":"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-07-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Microstructural and compositional failure analysis of Cr-CrCu-Cu thin films for ball grid array (BGA) applications\",\"authors\":\"N. Zhang, M. Mcnicholas, N. Colvin\",\"doi\":\"10.1109/IPFA.1997.638119\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A PVD Cr-CrCu-Cu metal scheme for flip chip applications was investigated varying the conditions of deposition power and temperature, and film thickness. The thin film stress and resistivity of the Cr-CrCu-Cu multilayers and the effect of film and thermal cycle reliability were studied. Thermal cycle reliability results proved to be a function of both the CrCu alloy and the Cu overlayer thickness. Analytical Electron Microscopy (AEM) results support the diffusion barrier relationship of CrCu layer.\",\"PeriodicalId\":159177,\"journal\":{\"name\":\"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-07-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.1997.638119\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.1997.638119","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Microstructural and compositional failure analysis of Cr-CrCu-Cu thin films for ball grid array (BGA) applications
A PVD Cr-CrCu-Cu metal scheme for flip chip applications was investigated varying the conditions of deposition power and temperature, and film thickness. The thin film stress and resistivity of the Cr-CrCu-Cu multilayers and the effect of film and thermal cycle reliability were studied. Thermal cycle reliability results proved to be a function of both the CrCu alloy and the Cu overlayer thickness. Analytical Electron Microscopy (AEM) results support the diffusion barrier relationship of CrCu layer.
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