三维x射线显微镜在扇形包装细线检测中的应用

2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI:10.23919/ICEP55381.2022.9795636

Cheng-Hsin Liu, Yu-Jen Chang, Yu-Hsiang Hsiao, Yi-Sheng Lin

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摘要

在这里，我们报告样品制备和电气测试的失效分析。对2 μm / 2 μm细线和空间的扇出封装进行失效分析，利用三维x射线识别亚微米缺陷。FIB结果证实了缺陷小于1μm, 3D x射线能力在2 μm细线封装上是有用的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages

Here, we report the sample preparation and electrical test for failure analysis. The failure analysis on the fan-out package with 2 μm / 2 μm fine-lines and space use 3D X-Ray to identify the submicron defect. The FIB results have verified the defect less than 1μm and the 3D X-Ray capability is useful on 2 μm fine-line packages.

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2022 International Conference on Electronics Packaging (ICEP)

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