B. Biswas, A. Glasser, S. Lipa, M. Steer, P. Franzon, D. Griffis, P. Russell
{"title":"片上互连的实验电学特性","authors":"B. Biswas, A. Glasser, S. Lipa, M. Steer, P. Franzon, D. Griffis, P. Russell","doi":"10.1109/EPEP.1997.634038","DOIUrl":null,"url":null,"abstract":"This paper describes the transmission line and capacitance measurements made on a 0.25 micron test chip. Transmission lines were characterized to frequencies up to 20 GHz using a Hewlett Packard network analyzer and capacitances were determined using conventional capacitance meter. These measurements will help to develop benchmark capacitance and resistance values of on-chip interconnect structures. Measurements of the physical dimension of the interconnect structures will facilitate the determination of the effects of geometric assumptions made by capacitance extraction tools.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Experimental electrical characterization of on-chip interconnects\",\"authors\":\"B. Biswas, A. Glasser, S. Lipa, M. Steer, P. Franzon, D. Griffis, P. Russell\",\"doi\":\"10.1109/EPEP.1997.634038\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the transmission line and capacitance measurements made on a 0.25 micron test chip. Transmission lines were characterized to frequencies up to 20 GHz using a Hewlett Packard network analyzer and capacitances were determined using conventional capacitance meter. These measurements will help to develop benchmark capacitance and resistance values of on-chip interconnect structures. Measurements of the physical dimension of the interconnect structures will facilitate the determination of the effects of geometric assumptions made by capacitance extraction tools.\",\"PeriodicalId\":220951,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1997.634038\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634038","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Experimental electrical characterization of on-chip interconnects
This paper describes the transmission line and capacitance measurements made on a 0.25 micron test chip. Transmission lines were characterized to frequencies up to 20 GHz using a Hewlett Packard network analyzer and capacitances were determined using conventional capacitance meter. These measurements will help to develop benchmark capacitance and resistance values of on-chip interconnect structures. Measurements of the physical dimension of the interconnect structures will facilitate the determination of the effects of geometric assumptions made by capacitance extraction tools.