介电袋垂直应变-冲击电离MOSFET (VESIMOS-DP)性能分析

I. Saad, Mohd Zuhir Bin Hamzah, C. B. Seng, K. A. Mohamad, B. Ghosh, N. Bolong, R. Ismail
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引用次数: 1

摘要

本文成功研制了具有介电袋的垂直应变硅锗冲击电离MOSFET (VESIMOS-DP)。通过对VESIMOS和VESIMOS-DP的比较,说明了加入介质袋(DP)对器件性能的影响。对于20nm ~ 80nm不同尺寸的VESIMOS-DP器件,其阈值电压VTH具有较好的稳定性。这种稳定性是由于源极和漏极之间电荷分担效应的减少。然而,除了δ p+ (DP +)三角形势垒外,DP层的存在还引入了另一个势垒。因此,增加的栅极电压需要克服这些障碍,并允许电子从源流向漏。此外,与没有DP层相比,DP层抑制了寄生双极晶体管效应,击穿电压更高。因此,将DP加入到VESIMOS中,提高了VESIMOS的性能,提高了VESIMOS的纳米电子器件性能。
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Performance Analysis of Vertical Strained-SiGe Impact Ionization MOSFET Incorporating Dielectric Pocket (VESIMOS-DP)
The Vertical Strained Silicon Germanium (SiGe) Impact Ionization MOSFET with Dielectric Pocket (VESIMOS-DP) has been successfully developed and analyzed in this paper. The comparison between VESIMOS and VESIMOS-DP was done to show the advantages of incorporating dielectric pocket (DP) to the performance of the device. An improved stability of threshold voltage, VTH was found for VESIMOS-DP device of various DP size ranging from 20nm to 80nm. The stability is due to the reducing charge sharing effects between source and drain region. However, the presence of DP layer has introduced another potential barrier in addition to the delta p+ (dp+) triangular potential barrier. Thus, increased amount of gate voltage needed to overcome those barriers and allows the electrons to flow from source to drain. Moreover, the DP layer has suppressed the parasitic bipolar transistor effect (PBT) with higher breakdown voltage as compared to without DP layer. Hence, the incorporation of DP into VESIMOS has enhanced its performance and presents elevated characteristics for nano-electronics device.
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