创新实践11C:韧性

Chen-Yong Cher, Mohan J. Kumar
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引用次数: 0

摘要

软硬件协同设计是实现平台级可靠性的关键机制。虽然避免错误是理想的,但从经济意义上讲,它并不总是实用的。通常使用的技术是检测硬件中的错误,并与软件协调实现恢复。本讲座将讨论在Intel至强处理器上实现这种协作的一些例子(例如,DIMM Sparing, MCA recovery),以及这种解决方案在平台验证、接口标准化、软件支持等方面的含义。
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Innovative practices session 11C: Resilience
Software Hardware co-design is a key mechanism to realizing reliability at platform level. While error avoidance is the ideal, it is not always practical in an economic sense. Often used technique is to detect errors in hardware and implement the recovery in coordination with software. This talk will discuss some examples of such coordination on Intel Xeon (e.g., DIMM Sparing, MCA recovery) and the implications of this type of solution such as platform validation, interface standardization, software enablement, etc.
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