{"title":"锡膏在正弦振动下的响应研究","authors":"D. He, Nduka Nnamdi (Ndy) Ekere, M. A. Currie","doi":"10.1109/IEMT.1997.626872","DOIUrl":null,"url":null,"abstract":"Solder paste is a dense suspension (volume fraction of about 50%) of spherical solder alloy particles in a flux/vehicle system. It is known to exhibit viscoelastic properties and under oscillatory shear, the dynamic viscosity has been shown to decrease as the shear frequency increases. This paper presents experimental results of the effect of sinusoidal vibration on solder paste, and its impact on the performance of the paste printing process. In the first experiment, the solder paste sample was horizontally vibrated inside a cylindrical container. Observations of the sample following vibration showed that a thin liquid rich layer was formed on the surface and at the interface between the container and the paste. In the second experiment the sample was placed on a flat plate and as the plate moved towards a vibration squeegee, the sample was pushed by the squeegee blade to produce a paste roll. In both experiments, the vibration frequency and amplitude were varied to observe their effect.","PeriodicalId":227971,"journal":{"name":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The study of the response of solder pastes under sinusoidal vibration\",\"authors\":\"D. He, Nduka Nnamdi (Ndy) Ekere, M. A. Currie\",\"doi\":\"10.1109/IEMT.1997.626872\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Solder paste is a dense suspension (volume fraction of about 50%) of spherical solder alloy particles in a flux/vehicle system. It is known to exhibit viscoelastic properties and under oscillatory shear, the dynamic viscosity has been shown to decrease as the shear frequency increases. This paper presents experimental results of the effect of sinusoidal vibration on solder paste, and its impact on the performance of the paste printing process. In the first experiment, the solder paste sample was horizontally vibrated inside a cylindrical container. Observations of the sample following vibration showed that a thin liquid rich layer was formed on the surface and at the interface between the container and the paste. In the second experiment the sample was placed on a flat plate and as the plate moved towards a vibration squeegee, the sample was pushed by the squeegee blade to produce a paste roll. In both experiments, the vibration frequency and amplitude were varied to observe their effect.\",\"PeriodicalId\":227971,\"journal\":{\"name\":\"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1997.626872\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1997.626872","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The study of the response of solder pastes under sinusoidal vibration
Solder paste is a dense suspension (volume fraction of about 50%) of spherical solder alloy particles in a flux/vehicle system. It is known to exhibit viscoelastic properties and under oscillatory shear, the dynamic viscosity has been shown to decrease as the shear frequency increases. This paper presents experimental results of the effect of sinusoidal vibration on solder paste, and its impact on the performance of the paste printing process. In the first experiment, the solder paste sample was horizontally vibrated inside a cylindrical container. Observations of the sample following vibration showed that a thin liquid rich layer was formed on the surface and at the interface between the container and the paste. In the second experiment the sample was placed on a flat plate and as the plate moved towards a vibration squeegee, the sample was pushed by the squeegee blade to produce a paste roll. In both experiments, the vibration frequency and amplitude were varied to observe their effect.
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