在InP上0.08 μ m栅极HEMT的最高电流增益截止频率

M. Riaziat, C. Nishimoto, S. Silverman, Y. Pao, S. Weng, M. Glenn, S. Bandy, R. Majidi-Ahy, G. Zdasiuk
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引用次数: 6

摘要

在InP衬底上制备了小于0.1 μ m的蘑菇形栅极InGaAs/InAlAs HEMTS,表明利用现有的电子束技术可以制作出高产量的器件。在InP上的InGaAs/InAlAs hemt中,短栅和高2DEG迁移率以及饱和速度的结合导致了三种具有前所未有速度的终端器件。实际栅极长度在0.07 ~ 0.09 μ m之间,在40 GHz下测得的最大稳定增益在14 ~ 16 dB之间,稳定因子k分别在0.7 ~ 0.35之间。这些器件的电流增益截止频率超过200 GHz, f/sub max/值超过300 GHz。
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Highest current gain cutoff frequency with 0.08 mu m gate HEMT on InP
InGaAs/InAlAs HEMTS with mushroom profile gates smaller than 0.1 mu m were processed on InP substrate, showing that such devices can be fabricated with high yield using available electron beam technology. The combination of short gate and high 2DEG mobility and saturated velocity in InGaAs/InAlAs HEMTs on InP has led to three terminal devices with unprecedented speed. The actual gate lengths varied between 0.07 and 0.09 mu m. The maximum stable gain measured at 40 GHz varied between 14 and 16 dB with a stability factor k ranging from 0.7 to 0.35, respectively. These devices exhibit current gain cutoff frequencies in excess of 200 GHz and f/sub max/ values above 300 GHz.<>
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Expertise, optimisation and control of InP and related technologies by scanning photoluminescence measurements Dislocation density after S-diffusion into p-type InP substrates Surface recombination and high efficiency in InP solar cells Molecular beam epitaxial growth techniques for graded-composition InGaAlAs/InP alloys Submicron double heterojunction strained InAlAs/InGaAs HEMTs: an experimental study of DC and microwave properties
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