{"title":"物联网计算机视觉应用的LPDDR4 SIPI联合仿真与测量关联","authors":"B. Silva, M. Eldessouki, Y. F. Shen","doi":"10.1109/EPEPS47316.2019.193230","DOIUrl":null,"url":null,"abstract":"Simulation-measurement correlation presents unique challenges that require co-simulation between SI and PI to capture all sources of noise. A new hybrid methodology using peak distortion analysis and realistic worst case SSN was devised to enable full channel simulation including both SI and PI effects. The method was verified against lab measurements on two different designs.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"150 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"LPDDR4 SIPI Co-Simulation and Measurement Correlation for IOT Computer Vision Application\",\"authors\":\"B. Silva, M. Eldessouki, Y. F. Shen\",\"doi\":\"10.1109/EPEPS47316.2019.193230\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Simulation-measurement correlation presents unique challenges that require co-simulation between SI and PI to capture all sources of noise. A new hybrid methodology using peak distortion analysis and realistic worst case SSN was devised to enable full channel simulation including both SI and PI effects. The method was verified against lab measurements on two different designs.\",\"PeriodicalId\":304228,\"journal\":{\"name\":\"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"150 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS47316.2019.193230\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS47316.2019.193230","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
LPDDR4 SIPI Co-Simulation and Measurement Correlation for IOT Computer Vision Application
Simulation-measurement correlation presents unique challenges that require co-simulation between SI and PI to capture all sources of noise. A new hybrid methodology using peak distortion analysis and realistic worst case SSN was devised to enable full channel simulation including both SI and PI effects. The method was verified against lab measurements on two different designs.
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