{"title":"高密度内存模块的可测试性特性","authors":"E. Parrella","doi":"10.1109/ASIC.1990.186104","DOIUrl":null,"url":null,"abstract":"A configurable multichip memory module designed in silicon-on-silicon hybrid form is discussed. The memory controller IC, which has been implemented in a CMOS gate array, also functions as an in-circuit tester for the memory chips. This capability, supplemented by the controller's own scan-path and boundary-scan features, results in increased in-field testability as well as greatly reduced production test costs.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Testability features in a high-density memory module\",\"authors\":\"E. Parrella\",\"doi\":\"10.1109/ASIC.1990.186104\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A configurable multichip memory module designed in silicon-on-silicon hybrid form is discussed. The memory controller IC, which has been implemented in a CMOS gate array, also functions as an in-circuit tester for the memory chips. This capability, supplemented by the controller's own scan-path and boundary-scan features, results in increased in-field testability as well as greatly reduced production test costs.<<ETX>>\",\"PeriodicalId\":126693,\"journal\":{\"name\":\"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit\",\"volume\":\"40 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-09-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASIC.1990.186104\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1990.186104","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Testability features in a high-density memory module
A configurable multichip memory module designed in silicon-on-silicon hybrid form is discussed. The memory controller IC, which has been implemented in a CMOS gate array, also functions as an in-circuit tester for the memory chips. This capability, supplemented by the controller's own scan-path and boundary-scan features, results in increased in-field testability as well as greatly reduced production test costs.<>