{"title":"通过含有涂层的PCM冷却电子组件","authors":"A. Novikov, D. Lexow, M. Nowottnick","doi":"10.1109/ESTC.2014.6962787","DOIUrl":null,"url":null,"abstract":"A novel concept of using phase change materials (PCM) to improve the thermal management of electronic components was investigated. The main idea is the smoothing of temperature peaks produced by the component itself or by high ambient temperature. This was realized by heat absorption during melting process of the PCM. Such materials can be used in powder form as additive to the standard coating material like resin or will be applied directly on the electronic component and encapsulated by a polymer material.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Cooling of electronic assemblies through PCM containing coatings\",\"authors\":\"A. Novikov, D. Lexow, M. Nowottnick\",\"doi\":\"10.1109/ESTC.2014.6962787\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel concept of using phase change materials (PCM) to improve the thermal management of electronic components was investigated. The main idea is the smoothing of temperature peaks produced by the component itself or by high ambient temperature. This was realized by heat absorption during melting process of the PCM. Such materials can be used in powder form as additive to the standard coating material like resin or will be applied directly on the electronic component and encapsulated by a polymer material.\",\"PeriodicalId\":299981,\"journal\":{\"name\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2014.6962787\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962787","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Cooling of electronic assemblies through PCM containing coatings
A novel concept of using phase change materials (PCM) to improve the thermal management of electronic components was investigated. The main idea is the smoothing of temperature peaks produced by the component itself or by high ambient temperature. This was realized by heat absorption during melting process of the PCM. Such materials can be used in powder form as additive to the standard coating material like resin or will be applied directly on the electronic component and encapsulated by a polymer material.
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