采用低成本复模塑料封装的宽带大功率SPDT和SP3T GaN MMIC开关

Tuong Nguyen, V. Zomorrodian, Thi Ri Mya Kywe
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引用次数: 3

摘要

介绍了采用低成本复模塑料封装的宽带、高功率GaN SPDT和SP3T MMIC开关的设计和性能测试。该开关工作在0.15-2.8 GHz频段,具有50W的连续波输入功率处理,低插入损耗和出色的隔离性。反射开关采用串联/并联电路结构,完全集成的输入和输出匹配使用片上螺旋电感和互补逻辑控制。开关场效应管的精确线性和非线性建模是电路设计过程中不可或缺的一部分,并进行了详细的讨论。
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Wideband high power SPDT and SP3T GaN MMIC switches in low-cost overmolded plastic package
The design and measured performance of wideband, high power GaN SPDT and SP3T MMIC switches in low-cost overmolded plastic package is presented. The switches operate in the 0.15–2.8 GHz band with class-leading CW input power handling of 50W, low insertion loss and excellent isolation. The reflective switches employ a series/shunt circuit architecture, fully integrated input and output matching using on-chip spiral inductors and complementary logic control. Accurate linear and non-linear modeling of the switch FETs is integral to the circuit design process and is discussed in some detail.
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