W/SiO2/Ta/Cu 90nm 1T1R CBRAM器件快速稳定的亚10ua脉冲操作

A. Belmonte, A. Fantini, R. Degraeve, U. Celano, W. Vandervorst, A. Redolfi, M. Houssa, M. Jurczak, L. Goux
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引用次数: 4

摘要

我们证明了基于SiO2介电介质的CBRAM器件可以针对低于10μA的应用,确保了大的编程窗口,快速和低电压的开关以及5 μA时的有限周期变异性。我们首次报道了在RRAM器件上在5 μA下可靠的1 μs形成操作。通过对基于SiO2和al2o3的器件的电学和物理特性的全面比较,表明开关层中的Cu迁移率起着关键作用,影响成形/开关速度以及低电流下的功能,并且可以通过适当选择开关层材料来调节。我们还将亚10 μA区电学性能的不匹配与两种电阻状态下不同灯丝结构的不匹配联系起来。
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Fast and Stable Sub-10uA Pulse Operation in W/SiO2/Ta/Cu 90nm 1T1R CBRAM Devices
We demonstrate that CBRAM devices based on SiO2 dielectric can target sub-10μA application, ensuring large programming window, fast and low-voltage switching and limited cycle-to-cycle variability at 5 μA. We report, for the first time, reliable 1-μs forming operation at 5 μA on RRAM devices. The thorough comparison of SiO2- and Al2O3-based devices, in terms of electrical and physical characterization, suggests that the Cu mobility in the switching layers plays a key role, impacting forming/switching speed as well as functionality at low current, and that it can be tuned by properly selecting the switching layer material. We also correlate the mismatch in the electrical performances in the sub-10 μA regime to different filament configurations in the two resistive states.
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