{"title":"智能电源和集成多芯片电源电路设计的快速热建模","authors":"P. Dupuy, J. Dorkel, P. Tounsi, L. Borucki","doi":"10.1109/ISPSD.1996.509474","DOIUrl":null,"url":null,"abstract":"This paper recalls how the two-port network theory can be introduced to solve the 3D heat flow equation in a multilayered plane structure. In this paper we present two pieces of software based on the application of this theory, which are used to analyze the thermal behavior of SmartMos circuits with a fairly good accuracy and short computational times. Finally, an illustration is given and some comparisons are made with experiments and an FE code.","PeriodicalId":377997,"journal":{"name":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Rapid thermal modeling for smart-power and integrated multichip power circuit design\",\"authors\":\"P. Dupuy, J. Dorkel, P. Tounsi, L. Borucki\",\"doi\":\"10.1109/ISPSD.1996.509474\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper recalls how the two-port network theory can be introduced to solve the 3D heat flow equation in a multilayered plane structure. In this paper we present two pieces of software based on the application of this theory, which are used to analyze the thermal behavior of SmartMos circuits with a fairly good accuracy and short computational times. Finally, an illustration is given and some comparisons are made with experiments and an FE code.\",\"PeriodicalId\":377997,\"journal\":{\"name\":\"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.1996.509474\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1996.509474","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Rapid thermal modeling for smart-power and integrated multichip power circuit design
This paper recalls how the two-port network theory can be introduced to solve the 3D heat flow equation in a multilayered plane structure. In this paper we present two pieces of software based on the application of this theory, which are used to analyze the thermal behavior of SmartMos circuits with a fairly good accuracy and short computational times. Finally, an illustration is given and some comparisons are made with experiments and an FE code.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
