光电器件鉴定新方法

P. Berthier, D. Laffitte, J. Périnet, J. Goudard, X. Boddaert, P. Chazan
{"title":"光电器件鉴定新方法","authors":"P. Berthier, D. Laffitte, J. Périnet, J. Goudard, X. Boddaert, P. Chazan","doi":"10.1109/ECTC.2002.1008149","DOIUrl":null,"url":null,"abstract":"Qualification of opto-electronic devices is a mandatory but complex activity to perform in a fast changing technical environment and under a strong market pressure. In this paper, we analyze the advantages and drawbacks of the traditional qualification approach based on both end-development tests defined by international standards and statistical reliability calculations. We explain how we are adapting our qualification practices towards risk assessment methods and design for reliability process. Looking at the future trends or telecom opto-electronic devices, possible challenges that qualification activity will have to face are finally discussed.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"New qualification approaches for opto-electronic devices\",\"authors\":\"P. Berthier, D. Laffitte, J. Périnet, J. Goudard, X. Boddaert, P. Chazan\",\"doi\":\"10.1109/ECTC.2002.1008149\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Qualification of opto-electronic devices is a mandatory but complex activity to perform in a fast changing technical environment and under a strong market pressure. In this paper, we analyze the advantages and drawbacks of the traditional qualification approach based on both end-development tests defined by international standards and statistical reliability calculations. We explain how we are adapting our qualification practices towards risk assessment methods and design for reliability process. Looking at the future trends or telecom opto-electronic devices, possible challenges that qualification activity will have to face are finally discussed.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008149\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008149","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

在快速变化的技术环境和强大的市场压力下,光电器件的鉴定是一项强制性但复杂的活动。本文分析了基于国际标准定义的末端开发试验和统计可靠性计算的传统定性方法的优缺点。我们解释了我们如何将我们的认证实践适应于风险评估方法和可靠性过程的设计。展望电信光电器件的未来发展趋势,最后讨论了资质认证活动可能面临的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
New qualification approaches for opto-electronic devices
Qualification of opto-electronic devices is a mandatory but complex activity to perform in a fast changing technical environment and under a strong market pressure. In this paper, we analyze the advantages and drawbacks of the traditional qualification approach based on both end-development tests defined by international standards and statistical reliability calculations. We explain how we are adapting our qualification practices towards risk assessment methods and design for reliability process. Looking at the future trends or telecom opto-electronic devices, possible challenges that qualification activity will have to face are finally discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Micropackaging using thin films as mechanical components Reaction kinetics of Pb-Sn and Sn-Ag solder balls with electroless Ni-P/Cu pad during reflow soldering in microelectronic packaging Low cost uncooled mini-DIL module for pump laser Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package A novel, wafer-scale technology for addressing process and cost obstacles associated with underfilling FCOB
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1