应用贝叶斯机器学习创建低成本硅失效机制帕累托

C. Schuermyer, Steve Palosh, P. Babighian, Yan Pan
{"title":"应用贝叶斯机器学习创建低成本硅失效机制帕累托","authors":"C. Schuermyer, Steve Palosh, P. Babighian, Yan Pan","doi":"10.1109/ASMC.2019.8791833","DOIUrl":null,"url":null,"abstract":"The increasing challenges with relying on Physical Failure Analysis and inline inspection for ramping the yield are the reason that Volume Scan Diagnostics Analysis (VSDA) has become a mainstream methodology that supplements traditional yield learning. Because scan diagnostics are inherently noisy, the results often require expert knowledge to manually select the location that has the highest likelihood of being correct. In this paper, Failure Mechanism Analysis (FMA) applies the technique of Bayesian Machine Learning in a yield analysis system that can empirically estimate sources of yield loss using physical diagnostic information.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Application of Bayesian Machine Learning To Create A Low-Cost Silicon Failure Mechanism Pareto\",\"authors\":\"C. Schuermyer, Steve Palosh, P. Babighian, Yan Pan\",\"doi\":\"10.1109/ASMC.2019.8791833\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The increasing challenges with relying on Physical Failure Analysis and inline inspection for ramping the yield are the reason that Volume Scan Diagnostics Analysis (VSDA) has become a mainstream methodology that supplements traditional yield learning. Because scan diagnostics are inherently noisy, the results often require expert knowledge to manually select the location that has the highest likelihood of being correct. In this paper, Failure Mechanism Analysis (FMA) applies the technique of Bayesian Machine Learning in a yield analysis system that can empirically estimate sources of yield loss using physical diagnostic information.\",\"PeriodicalId\":287541,\"journal\":{\"name\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"62 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2019.8791833\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791833","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

依靠物理失效分析和在线检测来提高良率的挑战越来越大,这也是卷扫描诊断分析(VSDA)成为传统良率学习补充的主流方法的原因。由于扫描诊断本身就存在噪声,因此通常需要专业知识来手动选择最有可能正确的位置。在本文中,失效机制分析(FMA)将贝叶斯机器学习技术应用于产量分析系统,该系统可以利用物理诊断信息经验地估计产量损失的来源。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Application of Bayesian Machine Learning To Create A Low-Cost Silicon Failure Mechanism Pareto
The increasing challenges with relying on Physical Failure Analysis and inline inspection for ramping the yield are the reason that Volume Scan Diagnostics Analysis (VSDA) has become a mainstream methodology that supplements traditional yield learning. Because scan diagnostics are inherently noisy, the results often require expert knowledge to manually select the location that has the highest likelihood of being correct. In this paper, Failure Mechanism Analysis (FMA) applies the technique of Bayesian Machine Learning in a yield analysis system that can empirically estimate sources of yield loss using physical diagnostic information.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Fast and accurate defect classification for CMP process monitoring A Deep Learning Model for Identification of Defect Patterns in Semiconductor Wafer Map The Etching of Silicon Nitride in Phosphoric Acid with Novel Single Wafer Processor Methods for RFSOI Damascene Tungsten Contact Etching Using High-Speed Video Analysis for Defect Investigation and Process Improvement
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1