{"title":"聚酰亚胺/金属水泡的校准断裂过程区域模型","authors":"A. Shirani, K. Liechti, F. J. Boerio","doi":"10.1115/imece1997-1238","DOIUrl":null,"url":null,"abstract":"\n The objective of this work was to determine the adhesive fracture energies associated with various interfaces that were produced by different methods of applying polyimide to an aluminum substrate. Due to the relatively small thicknesses of the polyimide films, blister tests were considered most appropriate. Nonetheless, a considerable amount of global yielding was anticipated (Shirani and Liechti, 1994), even for peninsula blisters. In order to make sure that extracted adhesive fracture values were not masked by global yielding effects, a fracture process zone modeling approach (Needleman, 1990 and Tvergaard and Hutchinson, 1993) was taken.","PeriodicalId":230568,"journal":{"name":"Applications of Experimental Mechanics to Electronic Packaging","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters\",\"authors\":\"A. Shirani, K. Liechti, F. J. Boerio\",\"doi\":\"10.1115/imece1997-1238\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The objective of this work was to determine the adhesive fracture energies associated with various interfaces that were produced by different methods of applying polyimide to an aluminum substrate. Due to the relatively small thicknesses of the polyimide films, blister tests were considered most appropriate. Nonetheless, a considerable amount of global yielding was anticipated (Shirani and Liechti, 1994), even for peninsula blisters. In order to make sure that extracted adhesive fracture values were not masked by global yielding effects, a fracture process zone modeling approach (Needleman, 1990 and Tvergaard and Hutchinson, 1993) was taken.\",\"PeriodicalId\":230568,\"journal\":{\"name\":\"Applications of Experimental Mechanics to Electronic Packaging\",\"volume\":\"46 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applications of Experimental Mechanics to Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece1997-1238\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applications of Experimental Mechanics to Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece1997-1238","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
这项工作的目的是确定与不同方法将聚酰亚胺应用于铝基板产生的各种界面相关的粘接断裂能。由于聚酰亚胺薄膜的厚度相对较小,泡罩试验被认为是最合适的。尽管如此,预计全球产量相当大(Shirani和Liechti, 1994年),甚至对于半岛水泡也是如此。为了确保提取的粘接断裂值不被全局屈服效应所掩盖,采用了断裂过程区建模方法(Needleman, 1990和Tvergaard and Hutchinson, 1993)。
Calibrated Fracture Process Zone Models for Polyimide/Metal Blisters
The objective of this work was to determine the adhesive fracture energies associated with various interfaces that were produced by different methods of applying polyimide to an aluminum substrate. Due to the relatively small thicknesses of the polyimide films, blister tests were considered most appropriate. Nonetheless, a considerable amount of global yielding was anticipated (Shirani and Liechti, 1994), even for peninsula blisters. In order to make sure that extracted adhesive fracture values were not masked by global yielding effects, a fracture process zone modeling approach (Needleman, 1990 and Tvergaard and Hutchinson, 1993) was taken.