J. Lorival, D. Deschacht, Y. Quéré, T. Gouguec, F. Huret
{"title":"亚微米互连中电容和电感耦合的可加性","authors":"J. Lorival, D. Deschacht, Y. Quéré, T. Gouguec, F. Huret","doi":"10.1109/DTIS.2006.1708701","DOIUrl":null,"url":null,"abstract":"Constant evolution in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. Inductive coupling effects on interconnects is an emerging concern in high performance digital integrated circuits. Based on an RLC transmission line model, associated to each propagation mode, a new crosstalk noise model is proposed to evaluate both the capacitive and the inductive coupling. The additivity of the coupling is shown and validated with several simulations","PeriodicalId":399250,"journal":{"name":"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Additivity of capacitive and inductive coupling in submicronic interconnects\",\"authors\":\"J. Lorival, D. Deschacht, Y. Quéré, T. Gouguec, F. Huret\",\"doi\":\"10.1109/DTIS.2006.1708701\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Constant evolution in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. Inductive coupling effects on interconnects is an emerging concern in high performance digital integrated circuits. Based on an RLC transmission line model, associated to each propagation mode, a new crosstalk noise model is proposed to evaluate both the capacitive and the inductive coupling. The additivity of the coupling is shown and validated with several simulations\",\"PeriodicalId\":399250,\"journal\":{\"name\":\"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DTIS.2006.1708701\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DTIS.2006.1708701","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Additivity of capacitive and inductive coupling in submicronic interconnects
Constant evolution in integrated circuit technology has led to an increase in the switching speed of the digital chip. As a result, there is a growing interest in the inductance associated with signal lines. Inductive coupling effects on interconnects is an emerging concern in high performance digital integrated circuits. Based on an RLC transmission line model, associated to each propagation mode, a new crosstalk noise model is proposed to evaluate both the capacitive and the inductive coupling. The additivity of the coupling is shown and validated with several simulations