采用堆叠印刷电路板结构实现的四臂半球形螺旋天线的设计与仿真

J. Ziegler, A. Zadehgol
{"title":"采用堆叠印刷电路板结构实现的四臂半球形螺旋天线的设计与仿真","authors":"J. Ziegler, A. Zadehgol","doi":"10.1109/EDAPS.2016.7893132","DOIUrl":null,"url":null,"abstract":"Electrically small antennas have received much research attention and antenna designs have been developed that approach the Chu lower bound. One such antenna design is the spherical helix antenna which can achieve Q values that are 1.5 times the Chu limit. The spherical helix antenna presents a complex geometry that is a design challenge to implement, especially for use in printed circuit board assemblies. A novel hemispherical antenna design is developed and simulated that utilizes stacks of two-layer printed circuit boards to create the 3D hemispherical structure. The advantages of this approach are: the realization of complex antenna geometries using cost efficient printed circuit board technology and the ability to change substrate material to provide dielectric loading of the antenna, while achieving comparable performance with wire based designs.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Design and simulation of a four-arm hemispherical helix antenna realized through a stacked printed circuit board structure\",\"authors\":\"J. Ziegler, A. Zadehgol\",\"doi\":\"10.1109/EDAPS.2016.7893132\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electrically small antennas have received much research attention and antenna designs have been developed that approach the Chu lower bound. One such antenna design is the spherical helix antenna which can achieve Q values that are 1.5 times the Chu limit. The spherical helix antenna presents a complex geometry that is a design challenge to implement, especially for use in printed circuit board assemblies. A novel hemispherical antenna design is developed and simulated that utilizes stacks of two-layer printed circuit boards to create the 3D hemispherical structure. The advantages of this approach are: the realization of complex antenna geometries using cost efficient printed circuit board technology and the ability to change substrate material to provide dielectric loading of the antenna, while achieving comparable performance with wire based designs.\",\"PeriodicalId\":191549,\"journal\":{\"name\":\"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2016.7893132\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2016.7893132","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

电小型天线已经得到了很多的研究关注,天线设计已经发展到接近楚氏下界。一种这样的天线设计是球形螺旋天线,它可以实现Q值是楚赫极限的1.5倍。球形螺旋天线呈现出复杂的几何形状,这是一个设计挑战,特别是在印刷电路板组件中使用。提出并模拟了一种新型半球形天线设计,利用多层印刷电路板叠加形成三维半球形结构。这种方法的优点是:使用经济高效的印刷电路板技术实现复杂的天线几何形状,并且能够改变衬底材料以提供天线的介电负载,同时实现与基于导线的设计相当的性能。
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Design and simulation of a four-arm hemispherical helix antenna realized through a stacked printed circuit board structure
Electrically small antennas have received much research attention and antenna designs have been developed that approach the Chu lower bound. One such antenna design is the spherical helix antenna which can achieve Q values that are 1.5 times the Chu limit. The spherical helix antenna presents a complex geometry that is a design challenge to implement, especially for use in printed circuit board assemblies. A novel hemispherical antenna design is developed and simulated that utilizes stacks of two-layer printed circuit boards to create the 3D hemispherical structure. The advantages of this approach are: the realization of complex antenna geometries using cost efficient printed circuit board technology and the ability to change substrate material to provide dielectric loading of the antenna, while achieving comparable performance with wire based designs.
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