PureB二极管的反偏置和击穿行为

L. Qi, K. Mok, M. Aminian, T. Scholtes, E. Charbon, L. Nanver
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引用次数: 1

摘要

本文研究了不同的PureB阳极窗和金属接触处理方法对PureB二极管的反偏置和击穿性能的影响。特别是,为了评估其在密集成像阵列中使用的适用性,对微米尺寸的器件进行了检查,因为密集成像阵列可能需要作为雪崩光电二极管进行操作以获得必要的光敏性[6]。对于这样的小型装置,植入保护环不可能在不支付填充因子的惩罚的情况下实现。同时,还希望将光敏区置于远离氧化物周长的位置,在那里高反向电流可能造成永久性损坏。因此,在二极管的中心区域使用n增强植入的“虚拟”保护在这里被应用。
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Reverse biasing and breakdown behavior of PureB diodes
In this paper, the reverse biasing and breakdown properties of the PureB diodes are investigated for different methods of processing the PureB anode window and the metal contacting. In particular, micron-sized devices are examined in order to assess their suitability for use in dense imaging arrays that may require operation as avalanche photodiodes to obtain the necessary photosensitivity [6]. For such small devices implanted guard rings cannot be implemented without paying a penalty in fill-factor. At the same time it is also desirable to position the photosensitive area away from the oxide perimeter where permanent damage can be inflicted by high reverse currents. Therefore, a “virtual” guard, using an n-enhancement implantation in the central region of the diode is applied here.
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