{"title":"低成本电子封装用ACA键合技术的现状与挑战","authors":"J. Liu","doi":"10.1109/ADHES.2000.860564","DOIUrl":null,"url":null,"abstract":"Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for decades on glass substrate, and recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. This paper summarises various technologies used in connection with ACA joining. A summary of our understanding on electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications are elaborated. Finally, future research areas and remaining issues are pointed out.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges\",\"authors\":\"J. Liu\",\"doi\":\"10.1109/ADHES.2000.860564\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for decades on glass substrate, and recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. This paper summarises various technologies used in connection with ACA joining. A summary of our understanding on electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications are elaborated. Finally, future research areas and remaining issues are pointed out.\",\"PeriodicalId\":222663,\"journal\":{\"name\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ADHES.2000.860564\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860564","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
ACA bonding technology for low cost electronics packaging applications-current status and remaining challenges
Anisotropically Conductive Adhesives (ACAs) have been used in electronics packaging for decades on glass substrate, and recently in contactless smart-card module assembly and for bare chip attach on flexible and rigid substrates. This paper summarises various technologies used in connection with ACA joining. A summary of our understanding on electrical, thermal, physical, chemical, environmental and cost behaviours of ACAs in conjunction with various packaging applications are elaborated. Finally, future research areas and remaining issues are pointed out.
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