Investigation of interface delamination of EMC-copper interfaces in molded electronic packages

Electronic packages in automotive industry are prone to harsh environmental attacks such as extreme temperatures, high temperature variations, shocks, vibrations, humidity and hazarding liquids. Plastic encapsulation is introduced to protect the electronic part by molding a compound material around it. This has been proven as a powerful solution to these challenges. Interfacial delamination is one of the major concerns in reliability issues of electronic packages with molding. To fulfill the reliability challenges, these packages require accurate reliability models and tools for lifetime estimation during the product design and development stage. Hence it is aspired to address the study of adhesion between molding compound and leadframe interface as one aspect in reliability studies.