可持续社会的微系统

2014 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) Pub Date : 2014-06-19 DOI:10.1109/IMFEDK.2014.6867043

M. Esashi

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引用次数: 0

摘要

晶圆级粘接技术已被应用于制造具有异质元件的微系统。在载流子晶圆上形成的器件被转移到LSI晶圆上，这使得通用异构集成成为可能。已应用于谐振器、压电开关、触觉传感器、电子源等增值器件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Micro systems for sustainable society

Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. This has been applied to resonator, piezoelectric switch, tactile sensor, electron source and other value-added devices.

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2014 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)

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