{"title":"模拟旋转膜的平面化特性","authors":"L. White","doi":"10.1109/VMIC.1989.78041","DOIUrl":null,"url":null,"abstract":"Summary form only given. A description is given of spun-on film contour modeling and characterization procedures that can be used to predict the planarization properties presented for resist and spin-on glass (SOG) materials. These parameters are related to spun-on solution properties and can be used to design spin-on film properties and processes to obtain specific planarization results. An equation describing the spin-on film contour is presented. The parameters appearing in the equation can be used to predict planarization properties on any complex topography and with multiple spun-on coatings. SOG films require special modeling considerations due to mass depletion effects, since their thin spun-on film thicknesses are typically much less than the step height.<<ETX>>","PeriodicalId":302853,"journal":{"name":"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modelling spin-on film planarization properties\",\"authors\":\"L. White\",\"doi\":\"10.1109/VMIC.1989.78041\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. A description is given of spun-on film contour modeling and characterization procedures that can be used to predict the planarization properties presented for resist and spin-on glass (SOG) materials. These parameters are related to spun-on solution properties and can be used to design spin-on film properties and processes to obtain specific planarization results. An equation describing the spin-on film contour is presented. The parameters appearing in the equation can be used to predict planarization properties on any complex topography and with multiple spun-on coatings. SOG films require special modeling considerations due to mass depletion effects, since their thin spun-on film thicknesses are typically much less than the step height.<<ETX>>\",\"PeriodicalId\":302853,\"journal\":{\"name\":\"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-06-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VMIC.1989.78041\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings., Sixth International IEEE VLSI Multilevel Interconnection Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VMIC.1989.78041","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Summary form only given. A description is given of spun-on film contour modeling and characterization procedures that can be used to predict the planarization properties presented for resist and spin-on glass (SOG) materials. These parameters are related to spun-on solution properties and can be used to design spin-on film properties and processes to obtain specific planarization results. An equation describing the spin-on film contour is presented. The parameters appearing in the equation can be used to predict planarization properties on any complex topography and with multiple spun-on coatings. SOG films require special modeling considerations due to mass depletion effects, since their thin spun-on film thicknesses are typically much less than the step height.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
