集成传感系统对VLSI电路的挑战

K. Wise
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引用次数: 3

摘要

综述了单片仪器系统发展面临的挑战。讨论了传感器技术,并给出了传感器与电路工艺融合的实例。值得注意的是,对于许多未来的系统,传感器,模拟电路,逻辑和存储器可能应该合并在一个芯片上,并且需要系统级标准来关注这些努力。结论是,基于微机的传感节点能够作为智能外设,并具有自检、自动校准和基于prom的数字补偿等功能,在十年内应该可以在单个芯片上实现
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VLSI circuit challenges for integrated sensing systems
The challenges facing the development of monolithic instrumentation systems are reviewed. Sensor technology is discussed, and examples of merging transducer and circuit processes are given. It is noted that, for many future systems, transducers, analog circuits, logic, and memory should probably be merged on a single chip, and system-level standards are needed to focus such efforts. It is concluded that microcomputer-based sensing nodes capable of functioning as smart peripherals and employing features such as self-testing, autocalibration, and PROM-based digital compensation should be realizable on a single chip within a decade
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