一个完整的VLSI处理LAPD协议(ISDN级别2)

Third Annual IEEE Proceedings on ASIC Seminar and Exhibit Pub Date : 1990-09-17 DOI:10.1109/ASIC.1990.186097

L. R. Ferreira

{"title":"一个完整的VLSI处理LAPD协议(ISDN级别2)","authors":"L. R. Ferreira","doi":"10.1109/ASIC.1990.186097","DOIUrl":null,"url":null,"abstract":"A set of ICs that can execute the bearer functions of one user network in an ISDN has been developed. This set consists of two chips for treatment of the physical layer (layer 1 of the OSI Reference Model) of the S and U interfaces, one chip for terminal adaptation and one chip for treatment of the link layer protocol carried by the D channel, the so called LAPD. The development of two of these chips is discussed. The first is the U interface layer 1 chip. The second, called TB22, is for the treatment of the signaling layer 2 function at D channel. Designed as a full custom ASIC, TB22 uses CMOS 1.25- mu m technology and has around 50000 transistors. A large demand for this device is expected.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"19 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A complete VLSI treatment for the LAPD protocol (ISDN level 2)\",\"authors\":\"L. R. Ferreira\",\"doi\":\"10.1109/ASIC.1990.186097\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A set of ICs that can execute the bearer functions of one user network in an ISDN has been developed. This set consists of two chips for treatment of the physical layer (layer 1 of the OSI Reference Model) of the S and U interfaces, one chip for terminal adaptation and one chip for treatment of the link layer protocol carried by the D channel, the so called LAPD. The development of two of these chips is discussed. The first is the U interface layer 1 chip. The second, called TB22, is for the treatment of the signaling layer 2 function at D channel. Designed as a full custom ASIC, TB22 uses CMOS 1.25- mu m technology and has around 50000 transistors. A large demand for this device is expected.<<ETX>>\",\"PeriodicalId\":126693,\"journal\":{\"name\":\"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit\",\"volume\":\"19 3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-09-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASIC.1990.186097\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1990.186097","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

开发了一套集成电路，可以在ISDN中执行单个用户网络的承载功能。这一套包括两个芯片，用于处理S和U接口的物理层(OSI参考模型的第1层)，一个芯片用于终端适配，一个芯片用于处理D通道承载的链路层协议，即所谓的LAPD。讨论了其中两种芯片的研制。首先是U接口层1芯片。第二个称为TB22，用于处理D通道的信令第2层功能。作为一个完全定制的ASIC, TB22采用CMOS 1.25 μ m技术，有大约50000个晶体管。预计这种设备的需求量很大。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A complete VLSI treatment for the LAPD protocol (ISDN level 2)

A set of ICs that can execute the bearer functions of one user network in an ISDN has been developed. This set consists of two chips for treatment of the physical layer (layer 1 of the OSI Reference Model) of the S and U interfaces, one chip for terminal adaptation and one chip for treatment of the link layer protocol carried by the D channel, the so called LAPD. The development of two of these chips is discussed. The first is the U interface layer 1 chip. The second, called TB22, is for the treatment of the signaling layer 2 function at D channel. Designed as a full custom ASIC, TB22 uses CMOS 1.25- mu m technology and has around 50000 transistors. A large demand for this device is expected.<>

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Third Annual IEEE Proceedings on ASIC Seminar and Exhibit

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