{"title":"精密压阻式MEMS压力传感器中键合材料分布影响的有限元建模","authors":"Åsmund Sandvand, E. Halvorsen, K. Aasmundtveit","doi":"10.1109/ESTC.2014.6962829","DOIUrl":null,"url":null,"abstract":"A MEMS pressure-sensor, including its vacuum reference cavity, is modelled with focus on resulting stress from a glass frit bonding process. Based on CT-scans of bonded samples, a parametric model for FEM analysis of observed variations in bonding material distribution has been developed. Simulations show a high influence of amount and distribution of excess glass frit material on the zero-point as well as a good correlation with manufacturing data. Simulated variations of glass frit material distribution shows a variation of the zero-point of -1.5 % full scale (FS) to -7.2 %FS, depending on configuration.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"47 38","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Finite element modelling of influence of bonding material distribution in precision piezoresistive MEMS pressure-sensors\",\"authors\":\"Åsmund Sandvand, E. Halvorsen, K. Aasmundtveit\",\"doi\":\"10.1109/ESTC.2014.6962829\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A MEMS pressure-sensor, including its vacuum reference cavity, is modelled with focus on resulting stress from a glass frit bonding process. Based on CT-scans of bonded samples, a parametric model for FEM analysis of observed variations in bonding material distribution has been developed. Simulations show a high influence of amount and distribution of excess glass frit material on the zero-point as well as a good correlation with manufacturing data. Simulated variations of glass frit material distribution shows a variation of the zero-point of -1.5 % full scale (FS) to -7.2 %FS, depending on configuration.\",\"PeriodicalId\":299981,\"journal\":{\"name\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"volume\":\"47 38\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-11-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2014.6962829\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2014.6962829","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Finite element modelling of influence of bonding material distribution in precision piezoresistive MEMS pressure-sensors
A MEMS pressure-sensor, including its vacuum reference cavity, is modelled with focus on resulting stress from a glass frit bonding process. Based on CT-scans of bonded samples, a parametric model for FEM analysis of observed variations in bonding material distribution has been developed. Simulations show a high influence of amount and distribution of excess glass frit material on the zero-point as well as a good correlation with manufacturing data. Simulated variations of glass frit material distribution shows a variation of the zero-point of -1.5 % full scale (FS) to -7.2 %FS, depending on configuration.
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