Enhancement of the spatial resolution of near-field immunity maps

Near-field injection is a promising method for the analysis of the susceptibility of electronic boards and circuits. The resulting immunity map provides a precise localization of the sensitive area to electromagnetic disturbances. A major requirement is the spatial resolution of the immunity map, which depends on the size of the injection probe and the separation distance between the probe and the device under test. This paper aims at proposing a post-processing method to enhance the spatial resolution of immunity map and validating it on case studies at board and integrated circuit levels.