混合模式加载下Sn/3.5Ag/0.75Cu和63Sn/37Pb焊点的等温低周疲劳试验

T. Park, Soon-Bok Lee
{"title":"混合模式加载下Sn/3.5Ag/0.75Cu和63Sn/37Pb焊点的等温低周疲劳试验","authors":"T. Park, Soon-Bok Lee","doi":"10.1109/ECTC.2002.1008220","DOIUrl":null,"url":null,"abstract":"To give a proper and accurate estimation of the fatigue life of solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. The loading phase is controlled by the angle of loading direction. Experiments are conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints. The isothermal mechanical low cycle fatigue tests were performed under several loading phases. Constant displacement controlled tests are performed using a micromechanical test apparatus. Failure patterns of the fatigue tests are observed and discussed. Morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Isothermal low cycle fatigue tests of Sn/3.5Ag/0.75Cu and 63Sn/37Pb solder joints under mixed-mode loading cases\",\"authors\":\"T. Park, Soon-Bok Lee\",\"doi\":\"10.1109/ECTC.2002.1008220\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To give a proper and accurate estimation of the fatigue life of solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. The loading phase is controlled by the angle of loading direction. Experiments are conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints. The isothermal mechanical low cycle fatigue tests were performed under several loading phases. Constant displacement controlled tests are performed using a micromechanical test apparatus. Failure patterns of the fatigue tests are observed and discussed. Morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008220\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008220","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

摘要

为了合理准确地估计焊点的疲劳寿命,提出了一种混合模式载荷下的机械疲劳试验方法。加载相位由加载方向角度控制。用63Sn/37Pb和Sn/3.5Ag/0.75Cu焊点进行了实验。进行了不同加载阶段的等温机械低周疲劳试验。恒位移控制试验采用微力学试验装置进行。对疲劳试验的失效模式进行了观察和讨论。通过对Morrow能量模型的检验,发现该模型是适用于焊点的低周疲劳模型。
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Isothermal low cycle fatigue tests of Sn/3.5Ag/0.75Cu and 63Sn/37Pb solder joints under mixed-mode loading cases
To give a proper and accurate estimation of the fatigue life of solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. The loading phase is controlled by the angle of loading direction. Experiments are conducted with 63Sn/37Pb and Sn/3.5Ag/0.75Cu solder joints. The isothermal mechanical low cycle fatigue tests were performed under several loading phases. Constant displacement controlled tests are performed using a micromechanical test apparatus. Failure patterns of the fatigue tests are observed and discussed. Morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints.
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