基于HfO/sub 2/ TiN栅极叠加至15nm栅极长度的全耗尽sSDOI cmosfet的共集成双应变通道

F. Andrieu, T. Ernst, O. Faynot, Y. Bogumilowicz, J. Hartmann, J. Eymery, D. Lafond, Y. Levaillant, C. Dupré, R. Powers, F. Fournel, C. Fenouillet-Béranger, A. Vandooren, B. Ghyselen, C. Mazure, N. Kernevez, G. Ghibaudo, S. Deleonibus
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引用次数: 18

摘要

我们报道了一种原始的双通道全耗尽CMOSFET结构,该结构基于绝缘子(DCOI)共积应变si (nMOS)和应变si /sub 0.6/Ge/sub 0.4/ (pMOS), HfO/sub 2//TiN栅极堆叠栅极长度为15nm。我们首次证明了n-和p- mosfet在35nm栅极长度下的I/sub - ON/短沟道SOI的改进(在75nm下为25%,在长沟道上为100%),并且与SiO/sub - 2/介电介质相比,栅极泄漏减少了30多年。同时,由于双通道工程,阈值电压调整是由适合高性能(HP) CMOS的中隙单金属栅极进行的。
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Co-integrated dual strained channels on fully depleted sSDOI CMOSFETs with HfO/sub 2//TiN gate stack down to 15nm gate length
We report an original dual channel fully depleted CMOSFET architecture on insulator (DCOI) co-integrating strained-Si (nMOS) and strained-Si/sub 0.6/Ge/sub 0.4/ (pMOS) with HfO/sub 2//TiN gate stacks down to 15nm gate length. We demonstrate for the first time an I/sub ON/ improvement for short channel SOI of 10% at 35nm gate length (25% at 75nm, 100% on long channels) for both n- and p-MOSFETs and a more than 3 decades gate leakage reduction compared to a SiO/sub 2/ dielectric. Meanwhile, thanks to the dual channel engineering, a threshold voltage adjustment is performed with a mid gap single metal gate suitable for high performance (HP) CMOS.
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