Hiroyuki Hagiwara, S. Niibayashi, Norimasa Fukazawa, Wataru Fujikawa, Jun Shirakami, Yudai Yoshimura, Kaishi Miyazaki, Isao Shitanda
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Theoretical Study on Insulation Reliability of Copper Circuits on Silver-Seed Layer
Mechanism of high insulation reliability of the circuits fabricated on silver-seed layer was investigated by the electrochemical measurement. The dissolution behavior of constituent metal of silver seed plating system (combination of silver and copper) showed the suppression of silver dissolution by existence of copper. Furthermore, it is also confirmed that the existence of silver does not accelerate the copper dissolution. We concluded that these metal dissolution behaviors play an important role in improving the insulation reliability of copper circuits on silver-seeds.
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